
选择性波峰焊(300)
机型特点丨ModelFeatures
●离线机型,需人工放板取板;
●机器集成喷雾与焊接为一体化设计;
●占地空间小,能耗低;
●焊接最大PCB板尺寸:300*300mm
●焊接方式:锡炉Z轴上下动,PCB板移动焊接;
●焊接效率=喷雾时间+焊接时间+人工取放板时间
OMline models require manual placement and retrieval of boards;
Machine integration spray and welding are integrated design;
Small footprint and low energy consumption;
Maximum PCB board size for soldering: 300 * 300mm
Welding method: Move the Z-axis of the tin furnace up and down, and move the PCB board for welding:
Welding cfficiency=spray time+welding time+manual plate removal time
上一篇:暂无
下一篇 : 选择性波峰焊(S350-m)
拨打电话即刻联系